ADT7518
Rev. A | Page 8 of 40
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
0.3 V to +7 V
Analog Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to GND
0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
40癈 to +120癈
Storage Temperature Range
65癈 to +150癈
Junction Temperature
150癈
16-Lead QSOP Package
Power Dissipation
1
(T
J
max T
A
)/?/DIV>
JA
Thermal Impedance
2
?SPAN class="pst ADT7518ARQZ_2284575_4">JA Junction-to-Ambient
105.44癈/W
?SPAN class="pst ADT7518ARQZ_2284575_4">JC Junction-to-Case
38.8癈/W
IR Reflow Soldering
Peak Temperature
220癈 (0癈/5癈)
Time at Peak Temperature
10 sec to 20 sec
Ramp-Up Rate
2癈/sec to 3癈/sec
Ramp-Down Rate
6癈/sec
Table 4. I
2
C Address Selection
ADD Pin
I
2
C Address
Low
1001 000
Float
1001 010
High
1001 011
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
Values relate to package being used on a 4-layer board.
2
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air cooled PCB-mounted
components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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